HTSP 强效导热硅脂

HTSP 强效导热硅脂

HTSP为含硅脂类,能够在非常宽泛的工作温度范围下提供超高的导热系数。HTSP拥有优异的性能是因为含有多种金属氧化物(陶瓷)粉末。这些材料是电气绝缘的来确保装配过程中因为接触到其他部件而导致的电流泄露。
HTSP is a silicon -containing lipid, which can provide ultra -high thermal conductivity at a very broad working temperature range. HTSP has excellent performance because it contains a variety of metal oxides (ceramic) powder. These materials are electrical insulation to ensure current leakage caused by contact with other components during the assembly process.

主要特点

Main feature

即使在高温状态下仍能具有超高的导热系数3.0W/m.K 优异的非蔓延特性。 宽泛的工作温度范围从-50摄氏度到200摄氏度。 低蒸发重量损失。

Even at high temperature, it can still have an ultra -high thermal conductivity of 3.0W/m.k. The broad working temperature range from -50 degrees Celsius to 200 degrees Celsius. Low -evaporating weight loss.


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