搜索
|
ALPHA OM-362
ALPHA OM-362
ALPHA OM-362是一款无铅、无卤素、免清洗锡膏，专为针对所有组件类型（包括底部焊端组件）提供超低空洞性能而特别配方的。OM-362在BGA组件上实现IPC第三级空隙率，并在底部终端组件 (BTC)上实现平均少于10%的空隙率。该锡膏旨在与Innolot等高可靠性合金以及传统的SAC合金一起实现超低空隙率的性能。
Alpha OM-362 is a lead-free, halogen-free, and cleaner-free total paste. It is specially formulated for all component types (including bottom solder components). OM-362 realizes the third-level gap rate of IPC on the BGA component, and achieves an average of less than 10%on the bottom terminal component (BTC). The total paste aims to achieve the performance of ultra -low gap rate with high -reliability alloys such as Innolot and traditional SAC alloys.
Alpha OM-362 is a lead-free, halogen-free, and cleaner-free total paste. It is specially formulated for all component types (including bottom solder components). OM-362 realizes the third-level gap rate of IPC on the BGA component, and achieves an average of less than 10%on the bottom terminal component (BTC). The total paste aims to achieve the performance of ultra -low gap rate with high -reliability alloys such as Innolot and traditional SAC alloys.
